Study On Thermal Conductivity Of Aluminum Nitride Substrate And Analysis Of Influence Of Oxygen Impurity
For a long time, most of the substrate materials of high-power hybrid integrated circuits have been using Al2O3 and BeO ceramics, but the thermal conductivity of the Al2O3 substrate is low, and the thermal expansion coefficient is not well matched with Si. Although the comprehensive performance of BeO is excellent, its high production cost and highly toxic shortcomings limit its application and promotion. Therefore, from the performance, cost and environmental protection factors, the two can not meet the needs of modern electronic power devices and development. Aluminum nitride ceramics have excellent comprehensive properties, is a new generation of advanced ceramics that has been widely concerned in recent years, and has a wide range of application prospects in many aspects, especially its advantages of high thermal conductivity, low dielectric constant, low dielectric loss, excellent electrical insulation, thermal expansion coefficient matching silicon and non-toxicity. ...