Which Ceramic Substrate Material is Optimal for High-Power IGBT Module Packaging?
In modern power electronics systems, the IGBT (insulated gate bipolar transistor) module is the core component of energy conversion and control, and its long-term stability and reliability are very important. As the key component of IGBT module package structure, ceramic clad substrate not only carries the circuit components, but also bears the heavy task of heat conduction, which directly affects the heat dissipation efficiency and service life of the module. This paper aims to explore the influence of different ceramic substrate materials on the performance of ceramic copper clad plate, especially from the perspective of thermal conductivity and thermal expansion coefficient matching, analyze the advantages and disadvantages of alumina, silicon nitride and aluminum nitride ceramic substrate materials, in order to provide a theoretical basis for the selection of high power module packaging materials. Application limitations of alumina substrates : Although alumina c...