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目前显示的是标签为“mechanical strength enhanced silicon nitride substrate”的博文

Thermal Conductivity Improvement of Silicon Nitride Substrate

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  In the field of advanced ceramic materials, silicon nitride (Si3N4) has attracted much attention for its excellent mechanical strength, chemical stability and high temperature properties. However, the thermal conductivity of silicon nitride ceramics, as one of the key factors affecting its wide application, has been an important subject in materials science research. This paper aims to investigate the heat transfer mechanism of silicon nitride ceramics, especially the lattice vibration and scattering phenomenon during phonon conduction, and focus on the unique role of carbon additives in the sintering process of silicon nitride and the mechanism of improving the thermal conductivity. Through the comprehensive analysis of experimental data and theoretical models, this paper aims to provide new ideas and strategies for the preparation of   silicon nitride substrate  with high thermal conductivity. Reunderstanding of heat transfer mechanism As a typical covalent bonded cer...