taotao

  With the rapid development of electronic technology, the integration and performance requirements of large-scale integrated circuits are increasing day by day. As a key supporting material, aluminum nitride ceramics have become an ideal cooling substrate and packaging material because of their excellent thermal conductivity, mechanical strength, corrosion resistance and excellent electrical properties. However, the high hardness, high brittleness and low fracture toughness of aluminum nitride ceramics pose a great challenge in the process of pursuing ultra-smooth surface quality. In particular, in the field of electronic packaging, surface roughness needs to be controlled at the nanoscale to minimize volume, reduce internal resistance and optimize heat dissipation performance. Therefore, how to use laser processing technology to achieve high quality flat processing surface of   aln substrate  has become a key problem to be solved in the field of material science and pre...