taotao

  In practical applications, in addition to high thermal conductivity and high electrical insulation properties,   aluminum nitride substrates  are also required to have high bending strength in many fields. At present, the three-point bending strength of aluminum nitride in circulation on the market is usually 400~500MPa, which seriously limits the promotion and application of aluminum nitride ceramic substrates, especially in the field of IGBT power devices with high reliability requirements. Due to the complex production process and high production cost of AlN materials, most of the domestic AlN materials are still unable to meet the application requirements of high thermal conductivity and high strength.   In the preparation of aluminum nitride ceramic substrate, the selection of sintering methods and sintering additives is often twice the result with half the effort, and the introduction of sintering additives is a common method for sintering aluminum nitri...