taotao

  In exploring   silicon nitride (Si3N4) substrate  materials as core to a high-performance thermal management solution, our understanding of their heat transfer mechanisms is critical. The main heat transfer mechanism of silicon nitride is known to rely on lattice vibration, a process that transfers heat through quantized hot charge carriers called phonons.   The propagation of phonons in the lattice is not a simple linear motion, but is affected by the complex coupling between the lattice, resulting in frequent collisions between phonons, which significantly reduces the mean free path of phonons, that is, the mean distance that phonons can travel freely between two collisions. This mechanism directly affects the thermal conductivity of silicon nitride materials.   Furthermore, various defects, impurities and grain interfaces in Si3N4 crystals become the main sources of phonon scattering. These scattering events also lead to a decrease in the mean free path of ...