taotao

  Aluminum nitride (AlN) ceramics, as a material with excellent thermal conductivity, mechanical properties and electrical properties, have been widely used in large-scale integrated circuits and electronic packages in recent years. Its excellent properties make it an ideal cooling substrate and packaging material. However, due to the high hardness, high brittleness and low fracture toughness of aluminum nitride ceramics, surface defects and sub-surface damage are easy to occur during processing. In order to meet the demand for ultra-smooth surface of integrated circuits, the polished surface of   aluminum nitride substrate  needs to achieve extremely high flatness and low surface roughness. This also makes how to effectively reduce the defects and damage in the processing has become an important research topic in the field of ultra-precision machining. In recent years, plasma assisted polishing (PAP) technology has gradually become an important means of polishing aluminu...

  In the field of semiconductor materials, silicon carbide (SiC) with its excellent thermal conductivity, wide band gap characteristics, high breakdown electric field strength and high electron mobility, is gradually becoming a research and development hotspot, leading the innovation of a new generation of electronic devices. As a substrate material for key components, the broad application prospects of silicon carbide are self-evident, from high-efficiency power electronics to high-frequency communication chips, its figure is everywhere. However, the extremely high hardness of silicon carbide materials (Mohs hardness of about 9.5) is like a double-edged sword, both giving it excellent physical properties, but also set up numerous obstacles for its processing.   Faced with the difficult problem of polishing and grinding  silicon carbide substrate , traditional processing methods are often inadequate, inefficient and costly. It is in this context that the metal friction in...

  With the rapid development of electronic technology, the integration and performance requirements of large-scale integrated circuits are increasing day by day. As a key supporting material, aluminum nitride ceramics have become an ideal cooling substrate and packaging material because of their excellent thermal conductivity, mechanical strength, corrosion resistance and excellent electrical properties. However, the high hardness, high brittleness and low fracture toughness of aluminum nitride ceramics pose a great challenge in the process of pursuing ultra-smooth surface quality. In particular, in the field of electronic packaging, surface roughness needs to be controlled at the nanoscale to minimize volume, reduce internal resistance and optimize heat dissipation performance. Therefore, how to use laser processing technology to achieve high quality flat processing surface of   aln substrate  has become a key problem to be solved in the field of material science and pre...

  With the rapid development of microelectronics technology, the requirements for electronic packaging materials are increasingly stringent. Aluminum nitride ceramics, with its excellent thermal conductivity, excellent mechanical properties, corrosion resistance and excellent electrical properties, become the leader of large-scale integrated circuit cooling substrate and packaging materials. However, the high hardness, high brittleness and low fracture toughness of aluminum nitride ceramics are like an insurmountable gap, which greatly challenges its application in the field of ultra-precision machining. Especially in the pursuit of ultra-smooth surface with surface roughness Ra ≤ 8 nm or even RMS < 2 nm, how to effectively reduce surface defects and sub-surface damage during machining has become a key problem restricting the wide application of aluminum nitride ceramics. In this context, ELID (Electrolytic in-process Dressing) grinding process offers innovative solutions to the...

  Today, with the rapid development of the electronics industry, aluminum nitride ceramics have become the first choice for large-scale integrated circuit cooling substrates and packaging materials because of their excellent thermal conductivity, excellent mechanical properties, corrosion resistance and good electrical properties. Especially in the pursuit of miniaturization and high performance integrated circuit chips, the lightweight and ultra-smooth surface of   aluminum nitride substrates  become the key to improve the overall performance. However, the high hardness, high brittleness and low fracture toughness of aluminum nitride ceramics have brought great challenges to its ultra-precision machining. How to achieve surface roughness as low as nanometer level without damaging the material itself has become a technical problem to be solved urgently in scientific research and industry. This paper focuses on the magnetorheological polishing process of aluminum nitride c...

  Aluminium oxide (Al2O3) rods , commonly referred to as alumina ceramic rods, stand out as a notable class of engineering materials, characterized by an unparalleled blend of superior qualities. Celebrated for their unparalleled hardness, longevity, and thermal resilience, these rods have become indispensable in a myriad of industrial contexts. A paramount attribute of alumina ceramic rods lies in their extraordinary hardness, ranking second only to diamond on the Mohs scale. This exceptional hardness imparts remarkable resistance to wear and abrasion, rendering them ideal for applications where withstanding intense mechanical stress is vital. Furthermore, these rods boast superior compressive strength, enabling them to sustain heavy loads without any compromise to their structural integrity. The aerospace industry is another sector that heavily relies on the exceptional properties of alumina ceramic rods. These rods find numerous applications in the design and construction of air...

  In the field of microelectronic packaging,   aluminum nitride ceramics   are gradually becoming the preferred material for high-performance chip cooling substrates due to their excellent thermal conductivity, mechanical strength and electrical properties. However, its high hardness and high brittleness can easily cause surface micro-cracks and sub-surface damage during processing, which directly affect the final properties and application effects of the material. Therefore, how to optimize the chemical mechanical polishing (CMP) process of aluminum nitride ceramics to effectively reduce or eliminate these processing defects has become a hot and difficult point in current research.   Aluminum nitride ceramics, as a high-performance advanced material, with its excellent thermal conductivity efficiency (thermal conductivity up to about 200-300 W/m·K, far exceeding traditional ceramic materials), excellent mechanical properties (high hardness, high strength), excellent...