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  With the continuous progress of microelectronics packaging technology, the power and integration of electronic components have significantly increased, which has led to a significant increase in the heat generation per unit volume, which has put forward more stringent requirements for the heat dissipation efficiency (that is, its heat conduction performance) of the new generation of circuit boards. At present, researchers are working to develop a variety of ceramic substrate materials with high thermal conductivity, including   aluminum nitride (AlN) ,   silicon carbide (SiC)  and   beryllium oxide (BeO) . However, BeO is environmentally limited due to its toxicity; SiC is not suitable for use as substrate material because of its high dielectric constant properties. In contrast, AlN is the preferred substrate material choice due to its similar thermal expansion coefficient and moderate dielectric constant to silicon (Si) materials.   Traditionally, thick film slurps are mainly design

  With the continuous evolution of microelectronics packaging technology, the power density of electronic components has increased significantly, resulting in a sharp increase in heat generation per unit volume, which has put forward more stringent standards for the performance of the new generation of circuit boards in terms of heat dissipation efficiency (thermal conductivity). At present, researchers are actively exploring and developing several ceramic substrate materials with high thermal conductivity, including   aluminum nitride (AlN) ,   silicon carbide (SiC)  and   beryllium oxide (BeO) . However, BEOs are environmentally limited due to their potential toxicity; SiC is not considered an ideal substrate material due to its high dielectric constant. In contrast, AlN has become a high-profile choice of substrate materials due to its similar coefficient of thermal expansion to silicon (Si) and moderate dielectric constant properties. Traditionally, thick film slurries have been ma

  With the development of microelectronics packaging technology, the power and density of electronic components are increasing, and the heat per unit volume is increasing, and the requirements for the heat dissipation capacity (that is, thermal conductivity) of the new generation of circuit board are also more stringent. At present, the high thermal conductivity   ceramic substrates  developed are   AlN ,   SiC  and   BeO . BeO is toxic and not conducive to environmental protection. The dielectric constant of SiC is too high to be used as substrate. AlN has attracted much attention because of its thermal expansion coefficient close to Si and moderate dielectric constant.   The traditional thick film slurry is developed based on the  Al2O3 substrate , and its composition is easy to react with the  AlN substrate  and produce gas, which has a disastrous impact on the performance of the thick film circuit. In addition, the thermal expansion coefficient of the AlN substrate is lower than th

  Scientists have found that microstructure and oxygen impurity content are the two most important factors affecting the thermal conductivity of AlN ceramics. Therefore, in order to improve the thermal conductivity of AlN ceramics, more attention must be paid to the preparation of ceramic powder raw materials and sintering process - and continuous experimental research shows that refining the original aluminum nitride powder and adding appropriate low temperature sintering additives are effective solutions.   The Selection of Powder Raw Materials Aluminum nitride powder is the prerequisite and key to preparing aluminum nitride ceramic materials with excellent properties. The driving force of aluminum nitride sintering process is surface energy, and fine particles of AlN powder can enhance the sintering activity, increase the sintering force and accelerate the sintering process. It is confirmed that when the initial particle size of the original aluminum nitride powder is 20 times small

  Excellent heat dissipation capacity is very important for LED, because in the process of converting electrical energy into light energy, there will be a large amount (70% to 80%) of the energy is converted into heat energy, and the greater the power, the more heat needs to be emitted. If these heat cannot be dissipated in time, the rise in junction temperature caused by them will not only lead to a reduction in LED output optical power, but also the chip will sharpen and accelerate, and the device life will be shortened, so LED products must ensure smooth heat dissipation. In the process of LED heat dissipation, the "package substrate" plays a very key role, so the development of high thermal conductivity heat dissipation substrate material has become an important way to solve the heat dissipation problem of LED devices and improve the luminous efficiency and service life of high-power LED.   With the increase of LED power, traditional resin substrates have long been unable

  Alumina ceramic substrates   embody a unique blend of durability, versatility, and functionality, making them an attractive choice for a diverse range of applications. Whether it's the rigorous demands of industrial operations or the intricate requirements of medical technologies, these tiles consistently deliver exceptional performance. In industrial settings, alumina ceramic tiles are a staple due to their remarkable ability to withstand high temperatures, corrosion, and wear. This resilience enables them to excel in environments that involve abrasive materials, harsh chemicals, or extreme heat, ensuring reliability and longevity. Moreover, alumina ceramic tiles have found a niche in the medical field, where their biocompatibility and exceptional hardness make them ideal for use in implants and prosthetic devices. Their strength and durability contribute to the development of reliable and long-lasting solutions that patients can trust. Additionally, the electronics industry als